论文标题
CMS外部跟踪器升级的不同硅传感器选项的实验研究
Experimental Study of Different Silicon Sensor Options for the Upgrade of the CMS Outer Tracker
论文作者
论文摘要
在计划在2027年左右开始的LHC（HL-LHC）的高光度阶段，预计该加速器将提供瞬时的峰值光度，最高为$ 7.5 \ times10^{34} $ cm $^{ - 2} $ s $ s $ s $^{ - 1} $。预见到十年来，预见到通用探测器Atlas和CMS的总体集成发光度为$ 3000 $甚至$ 4000 $ 〜fb $^{ - 1} $，从而大大提高了LHC实验的发现潜力。 CMS检测器将对HL-LHC进行重大升级，其中全新的跟踪检测器由外部跟踪器和内部跟踪器组成。但是，新的跟踪系统将暴露于比当前的跟踪器明显更高的辐射，需要新的辐射传感器。 CMS从2009年开始进行广泛的辐照和测量活动，以系统地比较外部跟踪器传感器的不同硅材料的性能和设计选择。在18种不同的晶圆材料，厚度和生产技术的组合中设计和实施了几种测试结构和传感器。用中子辐照之前和之后，这些设备的表征是电气表征的，并带有不同能量的质子，其通力与$ 3000 $ 〜fb $^{ - 1} $后的CMS外部跟踪器不同半径相对应。进行的测试包括对$β$源，激光器和梁扫描的研究。本文比较了HL-LHC硅传感器的不同选项的性能，重点是硅体积材料和厚度。
During the high-luminosity phase of the LHC (HL-LHC), planned to start around 2027, the accelerator is expected to deliver an instantaneous peak luminosity of up to $7.5\times10^{34}$ cm$^{-2}$s$^{-1}$. A total integrated luminosity of $3000$ or even $4000$~fb$^{-1}$ is foreseen to be delivered to the general purpose detectors ATLAS and CMS over a decade, thereby increasing the discovery potential of the LHC experiments significantly. The CMS detector will undergo a major upgrade for the HL-LHC, with entirely new tracking detectors consisting of an Outer Tracker and Inner Tracker. However, the new tracking system will be exposed to a significantly higher radiation than the current tracker, requiring new radiation-hard sensors. CMS initiated an extensive irradiation and measurement campaign starting in 2009 to systematically compare the properties of different silicon materials and design choices for the Outer Tracker sensors. Several test structures and sensors were designed and implemented on 18 different combinations of wafer materials, thicknesses, and production technologies. The devices were electrically characterized before and after irradiation with neutrons, and with protons of different energies, with fluences corresponding to those expected at different radii of the CMS Outer Tracker after $3000$~fb$^{-1}$. The tests performed include studies with $β$ sources, lasers, and beam scans. This paper compares the performance of different options for the HL-LHC silicon sensors with a focus on silicon bulk material and thickness.
