论文标题
量子Hall Corbino设备的热电冷却特性
Thermoelectric cooling properties of a quantum Hall Corbino device
论文作者
论文摘要
我们根据电导的实验数据，分析了Corbino设备在量子厅制度中的热电冷却性能。我们专注于在线性响应内外的冷却能力和性能系数。该设备中的热电电压测量在{\ em Phys。修订版应用，{\ bf 14} 034019（2020）}表示，该运输是在扩散状态下进行的，而没有由于电子 - phonon相互作用而在广泛温度和填充因子中产生的效果签名。在此制度中，可以通过单个传输函数来描述电子的热和电流电流。我们从电导测量的实验数据中推断出此功能，并计算出广泛的填充因子和温度的冷却能力和性能系数，作为热和电偏见的功能。我们预测几个参数制度中的有趣冷却性能。
We analyze the thermoelectric cooling properties of a Corbino device in the quantum Hall regime on the basis of experimental data of electrical conductance. We focus on the cooling power and the coefficient of performance within and beyond linear response. Thermovoltage measurements in this device reported in {\em Phys. Rev. Applied, {\bf 14} 034019 (2020)} indicated that the transport takes place in the diffusive regime, without signatures of effects due to the electron-phonon interaction in a wide range of temperatures and filling factors. In this regime, the heat and charge currents by electrons can be described by a single transmission function. We infer this function from experimental data of conductance measurements and we calculate the cooling power and the coefficient of performance for a wide range of filling factors and temperatures, as functions of the thermal and electrical biases. We predict an interesting cooling performance in several parameter regimes.
