论文标题
制造周期性硅微/纳米线阵列及其轻捕获特性的平纹图。
Lithography Free Process for the Fabrication of Periodic Silicon Micro/Nano-Wire Arrays and Its Light-trapping Properties
论文作者
论文摘要
通过结合改良金属辅助化学蚀刻(MACE)和反应性离子蚀刻(RIE)方法,已合成了不同大小的垂直排列的硅微/纳米线阵列。这是一种制造硅微/纳米线阵列的新型无光刻方法。微/纳米线阵列的大小通过控制二氧化硅颗粒的蚀刻速率和直径来控制。硅微/纳米线的几何形状可以从不纯净的硅晶片中有效收集光生成的电荷载体,这些硅晶片的少数载流子扩散长度也是一个自我抗反射涂层层。对于微/纳米线,平均直径为40 nm,330 nm和950 nm及其相应的平均长度分别为1.12微米,1.1微米和1微米,观察到的平均反射率为0.22%,0.6和0.33%,在45度入射角,平均反射率在4.2,9.2和11%的范围内,相当于3.2,和11%,差异为11%,并分为11%。太阳光谱的1200 nm。与平面硅晶片相比,这些样品的测量平均反射率很低。因此,该几何形状是制造低成本且高效的径向连接硅微/纳米线阵列太阳能电池的有前途的候选者。
Vertically aligned silicon micro/nanowire arrays of different sizes have been synthesized by combining the modified metal-assisted chemical etching (MACE) and reactive ion etching (RIE) methods. This is a novel lithography-free method to fabricate silicon micro/nanowire arrays. The size of micro/nanowire arrays is controlled by controlling the etching rate and diameter of silica particles. The silicon micro/nanowire geometry can utilize for efficient collection of photo-generated charge carriers from impure silicon wafers, which have a short minority carrier diffusion length also act as a self-antireflection coating layer. For micro/nanowire having average diameters of 40 nm, 330 nm and 950 nm and their corresponding average length 1.12 micron, 1.1 micron, and 1 micron, respectively, the observed average reflectance was 0.22, 0.6 and 0.33 percent at 45-degree incident angle, while the average reflectance was increased up to 4.2, 9.2, and 11 percent, respectively at 75-degree incident angle in the broad range of 300 - 1200 nm of the solar spectrum. The measured average reflectance for these samples is quite low compared to the planar silicon wafer. Thus this geometry is a promising candidate for fabricating low-cost and highly efficient radial junction silicon micro/nanowire arrays based solar cells.