论文标题
具有高级包装技术的基于芯片的建筑的成本感知探索
Cost-Aware Exploration for Chiplet-Based Architecture with Advanced Packaging Technologies
论文作者
论文摘要
基于Chiplet的包装〜（SIP）技术可以通过各种芯片之间的连接和异质集成来实现更大的设计灵活性。但是，尚不知道如何将这种灵活性转化为成本效率，这在做出设计决策时至关重要。在本文中，我们开发了一个分析成本模型，该模型可以在各种互连选项和技术节点下估算2.5D基于2.5D的SIP系统的成本。我们使用我们的成本模型进行了两项案例研究，以探索2.5D基于chiplet的SIP系统的成本特征。根据案例研究，我们对基于成本效益的基于chiplet的SIP设计的插入器选择，设计分区粒度和技术节点的采用进行了几次观察。
The chiplet-based System-in-Package~(SiP) technology enables more design flexibility via various inter-chiplet connection and heterogeneous integration. However, it is not known how to convert such flexibility into cost efficiency, which is critical when making a design decision. In this paper, we develop an analytical cost model that can estimate the cost of the 2.5D chiplet-based SiP systems under various interconnection options and technology nodes. We conducted two case studies using our cost model to explore the cost characteristics of the 2.5D chiplet-based SiP system. Based on the case studies, we made several observations on the interposer selection, design partition granularity, and technology node adoption for cost-efficient chiplet-based SiP design.
