论文标题
集成电路制造中的模具依恋和电线粘合缺陷的检测方法的调查
A Survey of Detection Methods for Die Attachment and Wire Bonding Defects in Integrated Circuit Manufacturing
论文作者
论文摘要
缺陷检测在综合电路（ICS）的制造过程中起着至关重要的作用。模具附件和电线键合是制造过程的两个步骤，这些步骤确定了IC中的功率和信号传输质量和可靠性。本文介绍了基于所使用的不同感应方式（包括光学，放射学，声学和红外热力学）来检测这些缺陷的方法的调查或文献综述。在本调查中提供了对使用的检测方法的讨论。常规学习方法和深度学习方法用于检测模具依恋和电线粘结缺陷以及挑战和未来的研究方向。
Defect detection plays a vital role in the manufacturing process of integrated circuits (ICs). Die attachment and wire bonding are two steps of the manufacturing process that determine the power and signal transmission quality and dependability in an IC. This paper presents a survey or literature review of the methods used for detecting these defects based on different sensing modalities used including optical, radiological, acoustical, and infrared thermography. A discussion of the detection methods used is provided in this survey. Both conventional and deep learning approaches for detecting die attachment and wire bonding defects are considered along with challenges and future research directions.
